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Nano Dimension and Hensoldt partner to develop 3D printed sensor technologies

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Israeli 3D printed electronics manufacturer Nano Dimension has partnered with Hensoldt, a German-headquartered sensor technology specialist. The two companies will use the DragonFly electronics 3D printer to develop applications for Hensoldt’s security and defense division.

Thomas Stocker, Hensoldt’s Head of Engineering, said, “Our focus is on providing our customers with the highest quality cutting-edge innovations […] By using the DragonFly, we’ve already accelerated our application development.”

“Now, our strategic collaboration with Nano Dimension is further empowering our engineers in expediting product development cycles, while giving them the freedom to explore next-generation designs and solutions not possible with traditional manufacturing methods.”

HENSOLDT - Detect and Protect

3D printing certification customized PCB 

Nano Dimension is known for its DragonFly 3D printer that can make customized PCBs on-demand.

To reduce the number of steps typically needed to make PCBs, and open up now possibilities in electronics manufacturers and organizations have set to explore the potential of 3D printed PCBs. NASA is using the technology to develop customized multisensor boards for space missions. and the U.S Air Force is leveraging the nScrypt‘s FiT system to make bespoke phased array antennae.

The DragonFly printer has also been used in many such applications including radio frequency (RF) space systems and IoT communication devices for smart homes.

The 3D printed radio frequency (RF) circuit board. Photo via Nano Dimension.
A 3D printed radio frequency (RF) circuit board. Photo via Nano Dimension.

Advancing sensor technologies

Hensoldt specializes in sensor technologies in the security and defense sector. The company already has a DragonFly 3D printer installed. With the help of engineers from Nano Dimension, Hensoldt will further advance its capabilities using the DragonFly 3D printer. 

Amit Dror, CEO of Nano Dimension, said, “Hensoldt  is doing some of the most advanced electronics work in the world, and we are delighted that our engineering team can help them lead the change in developing additive manufacturing certification in electronics and building the applications of tomorrow.”

“We expect to see great advances in electronics technology emerge through this collaboration.”

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Featured image shows a 3D printed radio frequency (RF) circuit board. Photo via Nano Dimension.